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d a t a sh eet preliminary specification supersedes data of 26th september 2001 file under bccomponents, bc01 2002 feb 27 bccomponents 150 clz aluminum electrolyt ic capacitors smd (chip) long life base plate, very low impedance
2002 feb 27 2 bccomponents preliminary specification aluminum electrolytic capacitors smd (chip) long life base plate, very low impedance 150 clz features ? polarized aluminum electrolytic capacitors, non-solid electrolyte, self healing ? smd-version with base plate, reflow solderable ? very low impedance, very high ripple current ? very long useful life: 3000 hours at 105 c ? charge and discharge proof, no peak current limitation ? supplied in blister tape on reel. applications ? smd technology, for high mounting density ? industrial and professional applications ? automotive, general industrial ? smoothing, filtering, buffering. cca71 6 fig.1 component outline. 150 clz jw14 140 clh 153 clv 125 c high temperature standard 175 tmp solid smd 175 c quick reference data description value nominal case sizes (l w h in mm) 8 8 10 to 10 10 14 rated capacitance range, c r 33 to 1000 f tolerance on c r 20% rated voltage range, u r 6.3to63v category temperature range ? 55 to +105 c endurance test at 105 c: 2000 hours useful life at 105 c: case size 10 10 10 2500 hours case size 10 10 14 3000 hours useful life at 40 c; 1.8 l r applied: case size 10 10 10 125000 hours case size 10 10 14 150000 hours shelf life at 0 v, 105 c 1000 hours based on sectional specification iec 60384-18/cecc32300 climatic category iec 60068 55/105/56
2002 feb 27 3 bccomponents preliminary specification aluminum electrolytic capacitors smd (chip) long life base plate, very low impedance 150 clz selection chart for c r , u r and relevant nominal case sizes (l w h in mm) preferred types in bold . marking ? rated capacitance (in f) ? rated voltage (in v) ? black mark or ? ? ? sign indicating the cathode (the anode is identified by bevelled edges) ? code indicating group number (z) ? date code, in accordance with ?iec 60062? . c r ( f) u r (v) 6.3101625355063 33 ?????? 8 8 10 47 ?????? 8 8 10 ?????? 10 10 10 68 ????? 8 8 10 10 10 10 100 ???? 8 8 10 10 10 10 10 10 14 150 ??? 8 8 10 ??? 220 ?? 8 8 10 8 8 10 10 10 10 10 10 14 ? 330 ? 8 8 10 8 8 10 10 10 10 10 10 14 ?? 470 8 8 10 8 8 10 10 10 10 10 10 14 ??? 680 ? 10 10 10 10 10 14 ???? 1000 10 10 10 10 10 14 ?????
2002 feb 27 4 bccomponents preliminary specification aluminum electrolytic capacitors smd (chip) long life base plate, very low impedance 150 clz mechanical data table 1 physical dimensions, mass and packaging quantities; see fig.2 packaging supplied in blister tape on reel. for general packaging information refer to data handbook bc01, section ?packaging? . table 2 tape and reel dimensions nominal case size l w h (mm) case code l max (mm) w max (mm) h max (mm) ? d (mm) b max (mm) s (mm) l 1 max (mm) mass (g) 8 8 10 0810 8.5 8.5 10.5 8.0 1.0 3.1 9.9 1.0 10 10 10 1010 10.5 10.5 10.5 10.0 1.0 4.5 11.8 1.3 10 10 14 1014 10.5 10.5 14.3 10.0 1.0 4.5 11.8 1.5 nominal case size l w h (mm) case code pitch p 1 (mm) tape width w (mm) tape thickness t 2 (mm) reel dia. (mm) packaging quantity per reel 8 8 10 0810 16 24 11.8 380 500 10 10 10 1010 16 24 11.8 380 500 10 10 14 1014 16 24 15.0 330 250 jw07 h w b 0.3 max. 0.4 0.2 d l 1 s l fig.2 dimensional outline. dimensions in mm. for dimensions see table 1.
2002 feb 27 5 bccomponents preliminary specification aluminum electrolytic capacitors smd (chip) long life base plate, very low impedance 150 clz mounting the capacitors are designed for automatic placement on to printed-circuit boards. optimum dimensions of soldering pads depend amongst others on soldering method, mounting accuracy, print lay-out and/or adjacent components. for recommended soldering pad dimensions, refer to fig.3 and table 3 soldering soldering conditions are defined by the curve, temperature versus time, where the temperature is that measured on the soldering pad during processing. for maximum conditions refer to fig.4. any temperature versus time curve which does not exceed the specified maximum curves may be applied. as a general principle, temperature and duration shall be the minimum necessary required to ensure good soldering connections. however, the specified maximum curves should never be exceeded. c a a b cca85 7 fig.3 recommended soldering pad dimensions. for dimensions see table 3. table 3 recommended soldering pad dimensions; see fig.3 case code a (mm) b (mm) c (mm) 0810 3.5 2.5 3.0 1010 4.3 2.5 4.0 1014 4.3 2.5 4.0 fig.4 maximum temperature load during infrared reflow soldering measured on the soldering pad. 250 280 80 0 50 200 mba533 180 150 100 200 220 240 260 160 140 120 100 t pad ( c) o t (s)
2002 feb 27 6 bccomponents preliminary specification aluminum electrolytic capacitors smd (chip) long life base plate, very low impedance 150 clz electrical data and ordering information unless otherwise specified, all electrical values in table 4 apply at t amb =20 c, p = 86 to 106 kpa, rh = 45 to 75%. ordering example symbol description c r rated capacitance at 100 hz, tolerance 20% i r rated rms ripple current at 100 khz, 105 c i l2 max. leakage current after 2 minutes at u r ta n max. dissipation factor at 100 hz z max. impedance at 100 khz electrolytic capacitor 150 clz series 220 f/50 v; 20% nominal case size: 10 10 14 mm; taped on reel catalogue number: 2222 150 95102. table 4 electrical data and ordering information; preferred types in bold u r (v) c r ( f) nominal case size l w h (mm) i r 105 c (ma) 100 khz i l2 2min ( a) tan 100 hz z 100 khz +20 c ( ? ) catalogue number 2222 150 ..... 6.3 470 8 8 10 435 30 0.24 0.25 95311 1000 10 10 10 670 63 0.24 0.13 95301 10 330 8 8 10 435 33 0.20 0.25 95411 470 8 8 10 435 47 0.20 0.25 95412 680 10 10 10 670 68 0.20 0.13 95401 1000 10 10 14 850 100 0.20 0.10 95402 16 220 8 8 10 435 35 0.16 0.25 95511 330 8 8 10 435 53 0.16 0.25 95512 470 10 10 10 670 75 0.16 0.13 95501 680 10 10 14 850 109 0.16 0.10 95502 25 150 8 8 10 420 38 0.14 0.28 95611 220 8 8 10 420 55 0.14 0.28 95612 330 10 10 10 640 83 0.14 0.14 95601 470 10 10 14 820 118 0.14 0.11 95602 35 100 8 8 10 405 35 0.12 0.30 95011 220 10 10 10 630 77 0.12 0.15 95001 330 10 10 14 790 116 0.12 0.12 95002 50 68 8 8 10 333 34 0.12 0.48 95111 100 10 10 10 490 50 0.12 0.24 95101 220 10 10 14 620 110 0.12 0.19 95102 63 33 8 8 10 270 21 0.10 0.65 95812 47 8 8 10 270 30 0.10 0.65 95811 47 10 10 10 390 30 0.10 0.38 95801 68 10 10 10 390 43 0.10 0.38 95802 100 10 10 14 507 63 0.10 0.29 95803
2002 feb 27 7 bccomponents preliminary specification aluminum electrolytic capacitors smd (chip) long life base plate, very low impedance 150 clz additional electrical data parameter conditions value voltage surge voltage for short periods iec 60384-18, subclause 4.14 u s 1.15 u r reverse voltage for short periods iec 60384-18, subclause 4.16 u rev 1v current leakage current after 2 minutes at u r i l2 0.01 c r u r inductance equivalent series inductance (esl) typ. 16 nh resistance equivalent series resistance (esr) at 100 hz calculated from tan max and c r (see table 4) esr = tan / 2 fc r capacitance (c) fig.5 typical multiplier of capacitance as a function of ambient temperature. curve 1: 10 v. curve 2: 63 v. c 0 = capacitance at 20 c, 100 hz. ?6 0020 jw15 ?4 0 ? 20 40 60 80 t amb ( c) 0.8 0.9 1.0 1.1 100 140 120 1.2 c c 0 1 2 2 1
2002 feb 27 8 bccomponents preliminary specification aluminum electrolytic capacitors smd (chip) long life base plate, very low impedance 150 clz dissipation factor (tan ) fig.6 multiplier of dissipation factor (tan ) as a function of ambient temperature. curve 1: 10 v. curve 2: 63 v. tan 0 = typical tan at 20 c, 100 hz. jw16 020 ? 40 ? 20 40 60 80 100 t amb ( c) ? 60 10 2 10 120 1 10 ? 1 2 2 1 1 tan tan 0 equivalent series resistance (esr) fig.7 typical multiplier of esr as a function of frequency. curve 1: 10 v. curve 2: 35 v. curve 3: 63 v. esr 0 = typical esr at 20 c, 100 hz. jw17 0.1 10 1 10 2 10 3 10 4 10 5 1 f (hz) 10 2 2 3 3 1 1 esr 0 esr
2002 feb 27 9 bccomponents preliminary specification aluminum electrolytic capacitors smd (chip) long life base plate, very low impedance 150 clz impedance (z) fig.8 typical impedance as a function of frequency. u r = 10 v curve 1: case code 0810, 470 f. curve 2: case code 1010, 680 f. curve 3: case code 1014, 1000 f. t amb =20 c. 10 5 jw169 10 4 10 3 10 2 10 10 2 10 1 0.1 0.01 f (hz) z ( ) ? 1 3 2 fig.9 typical impedance as a function of frequency. u r = 35 v curve 1: case code 0810, 100 f. curve 2: case code 1010, 220 f. curve 3: case code 1014, 330 f. t amb =20 c. 10 5 jw170 10 4 10 3 10 2 10 10 2 10 1 0.1 0.01 f (hz) z ( ) ? 1 3 2
2002 feb 27 10 bccomponents preliminary specification aluminum electrolytic capacitors smd (chip) long life base plate, very low impedance 150 clz fig.10 typical impedance as a function of frequency. u r = 63 v curve 1: case code 0810, 47 f. curve 2: case code 1010, 68 f. curve 3: case code 1014, 100 f. t amb =20 c. 10 5 jw171 10 4 10 3 10 2 10 10 2 10 1 0.1 0.01 f (hz) z ( ) ? 1 3 2 ripple current and useful life table 5 multiplier of ripple current (i r ) as a function of frequency frequency (hz) i r multiplier u r =6.3to25v u r =35v u r =50to63v 100 0.70 0.65 0.60 300 0.80 0.80 0.75 1000 0.85 0.85 0.85 3000 0.93 0.93 0.93 10000 0.95 0.95 0.95 30000 0.97 0.97 0.97 100000 1.00 1.00 1.00
2002 feb 27 11 bccomponents preliminary specification aluminum electrolytic capacitors smd (chip) long life base plate, very low impedance 150 clz 3.8 3.7 3.6 3.5 3.4 3.3 3.2 3.0 2.8 2.6 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.5 0.0 3.1 40 50 60 70 80 90 100 110 mea240 lifetime multiplier t amb (c) o i a r i 1) 200 100 60 30 150 20 6.0 4.0 2.0 1.5 12 8.0 3.0 1.0 fig.11 multiplier of useful life as a function of ambient temperature and ripple current load. i a = actual ripple current at 100 khz. i r = rated ripple current at 100 khz, 105 c. (1) useful life at 105 c and i r applied: case code 1010: 2500 hours; case code = 1014: 3000 hours.
2002 feb 27 12 bccomponents preliminary specification aluminum electrolytic capacitors smd (chip) long life base plate, very low impedance 150 clz specific tests and requirements general tests and requirements are spec ified in data handbook bc01, section ?tests and requirements?. table 6 test procedures and requirements test procedure (quick reference) requirements name of test reference mounting iec 60384-18, subclause 4.3 shall be performed prior to tests mentioned below; reflow soldering; for maximum temperature load refer to chapter ?mounting? ? c/c: 5% tan ? spec. limit i l2 spec. limit endurance iec 60384-18/ cecc32300, subclause 4.15 t amb = 105 c; u r applied; 2000 hours u r =6.3v; ? c/c: 25% u r 10 v; ? c/c: 20% tan ? 2 spec. limit i l2 spec. limit useful life cecc 30301, subclause 1.8.1 t amb = 105 c; u r and i r applied; case size 10 10 10: 2 500 hours case size = 10 10 14: 3 000 hours, ? c/c: 50% tan ? 3 spec. limit i l2 spec. limit no short or open circuit total failure percentage: 1% shelf life (storage at high temperature) iec 60384-18/ cecc32300, subclause 4.17 t amb = 105 c; no voltage applied; 1000 hours after test: u r to be applied for 30 minutes, 24 to 48 hours before measurement for requirements see ?endurance test? above

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